Effect of Ag nanopowders on microstructure, hardness and elastic modulus of Sn-Bi solders

Xiaochun Lv, Peng He, Feng Pan, Bing Du, Fengjiao Lu, Yiyu Qian

Abstract


This paper presents the microstructure, hardness and elastic modulus of Sn58Bi, Sn57Bi1Ag and Ag nanopowders reinforced Sn58Bi composite solders. Microstructural observations reveal that the Ag nanopowders reinforced Sn58Bi composite solders have smaller grains of Ag3Sn and a more uniform Ag3Sn distribution in comparison with those of Sn57Bi1Ag solder. Nanoindentation test results show that the addition of Ag nanopowders has greatly enhanced the mechanical properties of Sn58Bi solder, i.e., it exhibits 13-30% increase in hardness and 10-22% increase in modulus of the composite solder. Besides, hardness and elastic modulus of solder are dependent on the size, distribution and the quantity of the second-phase.

Keywords


Ag nanopowders;composite solder;microstructure;nanoindentation test

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ISSN 1330-9587 (Print), ISSN 1849-0433 (Online)

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